Deja Vu All Over Again - part the sixth

Here's a quote from a recent AnandTech report on future generations of HPC chip making:

At 700W, H100 already requires liquid cooling; and the story is much the same for the chiplet based Ponte Vecchio from Intel, and AMD's Instinct MI250X. But even traditional liquid cooling has its limits. By the time chips reach a cumulative 1 kW, TSMC envisions that datacenters will need to use immersion liquid cooling systems for such extreme AI and HPC processors. Immersion liquid cooling, in turn, will require rearchitecting datacenters themselves, which will be a major change in design and a major challenge in continuity.
[my emphasis]

The geezers among the readership will likely notice that description. Back when IBM was The Mainframe Segment, it developed what it called the thermal conduction module, which operated much like an immersion device.

And, of course, IBM reverted to liquid cooling more than a decade ago. After only a few years of air cooled mainframes.

And, here's a recent take on cooling.

So, what's the ultimate in cooling tech? For my money, it's fission reactor cooling: liquid sodium.